pHotonics ELectronics functional Integration on CMOS
The mission of the large scale integrating project HELIOS was to make CMOS photonics accessible to a broad circle of users. During 4 years, from 2008 to 2012, the HELIOS consortium developed innovative means to combine a photonic layer with a CMOS circuit, using microelectronics fabrication processes.
HELIOS gathered 19 partners among the major European CMOS Photonics and Electronics players and potential users. It drove the European RTD in CMOS Photonics and paved the way for industrial development.
The development of building blocks led to results exceeding the original specifications and moreover positioning the laboratories at the leading edge of the state of the art in the field. Even if it has been challenging to assemble these buildings blocks to fabricate demonstrators as the technology was more complex, advanced transceivers have been obtained. Three different ways of integration the photonic devices with electronic devices on a wafer to wafer basis were pushed with some success. With the work on innovative devices, amorphous silicon modulator exhibited performances far beyond the original expectations. Even if lasing with Si nanocrystals has not been achieved, guided electroluminescence from slot waveguides and micro-ring resonators has been observed. CMOS-compatible 2.5D III-V/Si VCSELs were highly-efficient optically-pumped and lasing with electrical pumping will be soon demonstrated. Moreover experimental demonstration of optical coupling of these VCSEL with silicon micro-guides has been achieved.
Several HELIOS partners are members of PLAT4M, which aims at building a European-based supply chain in silicon photonics
HELIOS has been completed successfully : final summary and partners contact d...
HELIOS completed !
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with...
First demonstration of a tunable transmitter on silicon at 10 Gb/s